Focused Ion Beam (FIB)

A focused ion beam (FIB) system is an instrument that extracts ions, typically from a liquid metal ion source such as gallium (Ga), accelerates them using an electric field, and then uses ion lenses to focus them into a fine beam for sample processing and imaging. By detecting the secondary electrons and secondary ions generated during irradiation, the surface morphology can be imaged similarly to that of a scanning electron microscope (SEM). Additionally, the focused ion beam sputter atoms from the sample surface, enabling precise nanoscale milling and machining. Furthermore, when a reactive gas is introduced during ion-beam irradiation, the gas molecules decompose, allowing localized deposition of metallic or insulating films. 

・Preparation of TEM thin-foil specimens and removal of damaged layers

・Three-dimensional reconstruction of internal structures using slice-and-view imaging

・Cross-sectional analysis of micro-scale foreign particles

・Repair of photomask defects (removal of unwanted material and filling of missing regions) 

＜Features＞

1. Enables a wide range of processing and observation by utilizing its capabilities to observe, mill, and deposit.

2. There are systems suited to specific applications, such as single-beam ion systems, cross-beam/dual-beam systems combined with SEM, and systems for large-area processing. 

3. By repeatedly milling with the ion beam and imaging with the SEM, the internal 3D structure of the sample can be reconstructed (slice-and-view).

4. TEM samples can be prepared from specific, localized regions on the microscale. 

＜Limitations＞

1. Since the irradiated area is slightly milled by the ion-beam, surface protection may be necessary depending on the purpose and conditions. 

2. Samples containing moisture or having low electrical conductivity require pretreatment, such as dehydration or conductive coating.

3. Processing time may vary depending on the the material. 

4. Because color information cannot be obtained, not all features visible under optical microscope can be distinguished. 

Basic Sample Information

▸Sample size:  Up to approximately 20 mm square, with a thickness of up to about 4 mm
       *For larger sample sizes, please contact us for further assistance

▸Please contact us regarding magnetic or powder materials.

▸Please ensure that the samples contain no moisture, solvents, or similar substances.

▸Preferably, the backside of the sample should be flat.

Required Information

▸Materials: main material, additives, and film composition

▸Please provide structural information for cross-sectional evaluation (a simple sketch is also fine) 

▸Whether assessment of topmost surface is required 

▸Information of the sample's electrical conductivity

▸Magnetic properties

▸For TEM sample preparation: Please provide the desired observation region (width and depth), the observation direction, the elements to be analyzed during EDX, etc.

When Sending the Sample

▸Please place the sample in a chip case, wafer case, or similar container, and ensure that nothing touches the observation surface or the analysis surface during transportation. (Please ensure that the sample is protected from breakage or damage during transportation.)

▸When placing the sample in a case, make sure it is secured so that it does not move inside.
       *Please do not use strong adhesive tapes or liquid materials to secure the backside.

▸Please indicate the Sample No. and ID (labeled on the sample surface, on the case, etc.). 
       *Please do not scribe on the backside

・Cross-Sectional FIB-SEM Observation (PDF)

・Preparation of Cross-Sectional SEM/TEM Samples Using FIB-SEM (PDF)