MBT Monotonic Bending Test
To evaluate the ability of electronic components and solder joints to withstand unidirectional bending stress applied to the board.
<To be provided at the time of request>
・Sample information (quantity and sample condition)
・Test conditions
・Standards ▶ IPC/JEDEC-9702, etc.
・Test board
Test details for reference:
CBT Cyclic Bending Test
To evaluate the ability of electronic components and solder joints to withstand repeated bending stress applied to the board.
<To be provided at the time of request>
・Sample information (quantity and sample condition)
・Test conditions
・Standards ▶ JESD22-B 113, etc.
・Test board
Test details for reference:
MS Mechanical Shock
To evaluate the ability of electronic components and solder joints to withstand mechanical shocks during transportation and use.
<To be provided at the time of request>
・Sample information (quantity and sample condition)
・Test conditions
・Standards ▶ IEC 60068-2-27, etc.
・Test board
Test details for reference:
