MBT Monotonic Bending Test
To evaluate the ability of electronic components and solder joints to withstand unidirectional bending stress applied to the board.
To be provided at the time of request:
・Sample information (quantity and sample condition)
・Test conditions
・Standards ▶ IPC/JEDEC-9702, etc.
・Test board
Test details for reference:
CBT Cyclic Bending Test
To evaluate the ability of electronic components and solder joints to withstand repeated bending stress applied to the board.
To be provided at the time of request:
・Sample information (quantity and sample condition)
・Test conditions
・Standards ▶ JESD22-B 113, etc.
・Test board
Test details for reference:
MS Mechanical Shock
To evaluate the ability of electronic components and solder joints to withstand mechanical shocks during transportation and use.
To be provided at the time of request:
・Sample information (quantity and sample condition)
・Test conditions
・Standards ▶ IEC 60068-2-27, etc.
・Test board
Test details for reference:
