Reliability Testing
Principle
Reliability testing plays a crucial role in ensuring the longevity and functionality of technological products, which is paramount for gaining access to the finished product supply chain and establishing credibility in the marketplace.
Our Strengths in Reliability Testing:
✓︎ One-stop support, including test board production and sample implementation
✓︎ Testing in compliance with international standards and customer specifications, based on our extensive database and experience
✓︎ Comprehensive coverage up to failure analysis
Component-level Reliability Testing
| Accelerated Environment Stress Test | ||
| Moisture Sensitivity Level Test | MSL | J-STD-020 JESD22-A113 |
| Temperature-Humidity-Bias | THB | JESD 47 JESD 22-A101 JESD 22-A110 JESD 22-A118 JESD 22-A102 IEC 60068-2-66 AEC-Q100 AEC-Q101 AEC-Q102 |
| Biased HAST | HAST | |
| Unbiased HAST | UHAST | |
| Pressure Cooker Test | PCT | |
| Temperature Cycling | TC | JESD 22-A104 |
| Accelerated Lifetime Simulation Test | ||
| Early Life Failure Rate | ELFR |
JESD22-A108 |
| High Temperature Operating Life Test | HTOL | JESD 47 JESD 74 JESD22-A108 |
| Non-volatile Memory Reliability | NVM | JESD 47 JESD22-A117 JESD22-A103 JESD22-A108 AEC-Q100 AEC-Q100-005 |
| Package Assembly Integrity Test | ||
| Wire Bond Shear | WBS | MIL-STD-883 METHOD 2011.7 JESD22-B116 |
| Wire Bond Pull | WBP | |
| Solder Ball Integrity | SB | MIL-STD IPC J-STD-002 |
| Package Lead Integrity Test | PLIT | JESD22-B105 |
| Package Assembly Integrity Test (AEC) WBS, WBP, SD, PD, SBS, LI |
- | JESD22-B100 JESD22-B105 JESD22-B108 AEC-Q100 AEC-Q104 MIL-STD-883 Method 2011 |
| Electrical Verification Test | ||
| Electrostatic Discharge Human Body Model |
HBM | MIL-STD-883 JS-001 2017 AEC-Q100-002 |
| Electrostatic Discharge Charged Device Model Test |
CDM | JS002-2018 AEC-Q100-011 EIA/ESDA-5.3.1 |
| Electrostatic Discharge Machine Model Test |
MM | JESD22-A115 AEC-Q100-003 |
| Electrostatic Discharge Socket-Charge Device Model Test |
SCDM | ANSI/ESD SP5.3.2 |
| Latch-up Test | LU | JESD-78 AEC-Q100-004 |
| Low Voltage Surge Test | - | - |
| Electromagnetic Compatibility (Transverse electric mode) |
EMC (TEM cell test) |
SAEJ1752/3 IEC61967/2 AEC-Q100 AEC-Q104 |
| Electromagnetic Compatibility (Near field scanner) |
EMC (Near field scanner) |
SAE-J1752/2 IEC 61967/3 |
| Mechanical Stress Test | ||
| Mechanical Shock Test |
MS | AEC-Q100 MIL-STD-883 Method 2001 JESD22-B110 JESD22-B103 |
| Variable Frequency Vibration Test |
VFV | |
| Constant Acceleration Test |
CA | |
Board-level Reliability Testing
| Low Strain Rate Test | ||
| Thermal Cycling Test | TC | JESD22-A104 IPC-9701 IEC-60068-2-14 MIL-STD-883 |
| Thermal Shock Test | TS | IEC-60068-2-14 MIL-STD-883 MIL-STD-202 MIL-STD-810 JESD22-A106 |
| Monotonic Bending Test | MBT | JESD 22-B113 IPC 9702 EIAJ-4702 |
| Cyclic Bending Test | CBT | |
| High Strain Rate Test | ||
| Mechanical Shock Test | MS | JESD 22-B110 JESD 22-B111 |
| Vibration Test | VT | JESD 22-B103 MIL-STD 883 method 2007 ASTM D4169 |
| Steady-State Test | ||
| Steady-State Test | - | JESD22-A101 |
| Mechanical Stress Test | ||
| Pull & Push Test | PPT | MIL-STD 883 MIL-STD 202 IEC 60068 JESD22-B105 EIAJ-4702 ASTM D903-98 ASTM D1876 EIA-364 SEMI G86-0303 |
| Die Strength Test | DST | |
| Button Test | BT | |
| Twist (torque) Test | TT | |
| Press Test | PT | |
| Strain Measurement | SM | |
Reliability Assessment of Automotive Electronic Components
Application Notes
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