In SiC substrates, defects generated during ion implantation may be difficult to recover even with subsequent annealing. Therefore, to alleviate and minimize the occurrence of defects and damage, it is common to perform ion implantation on SiC substrates at high temperatures. At our company, we have such capabilities.
There is a significant difference between room temperature and high temperature (500°C). By conducting high-temperature ion implantation, the damage inflicted on the semiconductor can be mitigated.
Ion implantation can be utilized to alleviate damage etc.
Implantation Temperature Setting |
Room temperature to 600℃ |
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Sample Size |
Room Temperature Small Pieces to 12-inch wafer |
400 keV Ion Implantation Device
Summarized information about our high-temperature ion implantation equipment
Download here "High-Temperature Ion Implantation and Annealing" Technical Brochure